Installation of electronic components

PCBA - components’ manual placement:
Installation and removal of BGA, FLIP-CHIP, CSP at a semi-automated station. QFP, SMD, DIP components. Manufacture preparation for manual insertion.

PCBA - components’ automated placement:
Installation and removal of BGA, FLIP-CHIP, CSP, SMD, SOP, QFP.Preparation and manufacturing of a template for brazing paste application. Manufacture preparation for automated insertion.

Copyright © 2011–2018 AXONIM Devices
Order service

Fill in the form to order


Your name:
Phone:
E-mail:
Message: