New system on module based on Xilinx Zynq EPP
AXONIM Devices company developed new processor module based on new platform from Xilinx - Zynq-7000.
This module developed together with German partner of AXONIM Devices company, and now ready to pre-order.
New powerfull SoC Xilinx - Zynq-7000 with industrial temp range is main core of module. This SoC has 2 cores ARM® Cortex-A9, FPGA and various peripheral for solving most of important tasks for industrial automation (PLC, servo controllers and etc), for building home automation and a lot of other tasks.
Main features of this module:
- Minimum copmonents for starting software in SoC: DDR3, NAND, QSPI and DC/DC;
- All peripherial interfaces are accessible with connectors. This is good thing for creating any end-hardware.
- Possible to change size of DDR3 RAM, NAND ROM and QSPI ROM without changing schematic and PCB;
- Size - 65 х 50 mm.
Engineers of AXONIM Devices company build full packet of documentation for this module, BSP for Embedded Linux, Windows Embedded Compact 7 and Android software. Already starting mass-production.
Main idea of this module - to reduce costs of Bill of Material.
On picture present PCB of this module. On this PCB installed 4 BGA packages (CLG484 for XC7Z020, 2 x 96FBGA для DDR3 RAM - 2 х 16 bit and NAND ROM in 63-VFBGA package).
Xilinx Zynq-7000 XC7Z020
|RAM||128 / 256 MB DDR3|
256 / 512 / 1024 / 2048 / 4096 MB NAND,
(PS): 2 x QSPI,
|Supported ОС||Microsoft® Windows Embedded Compact 7,
Embedded Linux 3.x,
|Size||56 х 50 mm|
|Power supply||3,3V (possible to power each bank separate)|
Full datasheet you can find here.